Reliability Test
|
Test items |
Purpose |
Test standards |
|
Solderability test |
Welding reliability |
IPC-TM-650 3.10 |
|
Tape tension test |
Ink adhesives testing |
PC-TM-650 2.4.1 & 2.4.28 |
|
Peel strength test |
Copper foil adhesion |
IPC-TM-650 2.4.8.5 |
|
Ion pollution test |
Surface cleanliness |
IPC-TM-650 2.3.25 & 2.3.26 |
|
Bending / warping tester |
twist and bow |
IPC-TM-650 2.4.22B |
|
Microsection |
Thickness of gold and nickel |
Customer standards |
|
X-Ray |
Thickness of copper, gold and nickel |
Customer standards |
|
CMI |
Thickness of copper |
Customer standards |
|
Impedance test |
Impedance value |
Customer standards |
|
High voltage test |
Insulation |
Customer standards |
Quality Assurance